{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8497207","patent":{"patent_number":"US-8497207","title":"Methods of forming semiconductor devices including landing pads formed by electroless plating","assignee":null,"inventors":[],"filing_date":"2010-07-02T00:00:00.000Z","publication_date":"2013-07-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor device in which an increase of contact resistance Rc between a metal contact and a plug due to misalignment between the metal contact and the plug can be reduced and the difficulty of a Cu filling process during the process of forming the plug may be reduced. The semiconductor device includes a substrate including an active area and a device isolation layer; a metal contact that is formed on the substrate and is electrically connected to the active area; a landing pad formed on the metal contact by electroless plating; and a plug that is formed on the landing pad and is electrically connected to the metal contact via the landing pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of forming semiconductor devices including landing pads formed by electroless plating","description":"A semiconductor device in which an increase of contact resistance Rc between a metal contact and a plug due to misalignment between the metal contact and the plug can be reduced and the difficulty of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8497207","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8497207","citation_suggestion":"Patentable. \"Methods of forming semiconductor devices including landing pads formed by electroless plating\" (US-8497207). https://patentable.app/patents/US-8497207","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8497207","json":"https://patentable.app/api/llm-context/US-8497207","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:35:22.772Z"}