{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8497574","patent":{"patent_number":"US-8497574","title":"High power semiconductor package with conductive clips and flip chip driver IC","assignee":null,"inventors":[],"filing_date":"2011-04-27T00:00:00.000Z","publication_date":"2013-07-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In one implementation, a high power semiconductor package is configured as a buck converter including a control transistor and a sync transistor disposed on a leadframe, a flip chip driver integrated circuit (IC) for driving the control and sync transistors, and conductive clips electrically coupling the top surfaces of the transistors to substrate pads such as leadframe pads. The source of the control transistor is electrically coupled to the drain of the sync transistor using the leadframe and one of the transistor conductive clips. In this manner, the leadframe and the conductive clips provide efficient current conduction by direct mechanical connection and large surface area conduction, thereby enabling a package with significantly reduced electrical resistance, form factor, complexity, and cost."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High power semiconductor package with conductive clips and flip chip driver IC","description":"In one implementation, a high power semiconductor package is configured as a buck converter including a control transistor and a sync transistor disposed on a leadframe, a flip chip driver integrated ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8497574","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8497574","citation_suggestion":"Patentable. \"High power semiconductor package with conductive clips and flip chip driver IC\" (US-8497574). https://patentable.app/patents/US-8497574","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8497574","json":"https://patentable.app/api/llm-context/US-8497574","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:51.353Z"}