{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8497585","patent":{"patent_number":"US-8497585","title":"Chip package","assignee":null,"inventors":[],"filing_date":"2011-06-30T00:00:00.000Z","publication_date":"2013-07-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A quad flat non-leaded package including a first patterned conductive layer, a second patterned conductive layer, a chip, bonding wires and a molding compound is provided. The first patterned conductive layer defines a first space, and the second patterned conductive layer defines a second space, wherein the first space overlaps the second space and a part of the second patterned conductive layer surrounding the second space. The chip is disposed on the second patterned conductive layer. The bonding wires are connected between the chip and the second patterned conductive layer. The molding compound encapsulates the second patterned conductive layers, the chip and the bonding wires. In addition, a method of manufacturing a quad flat non-leaded package is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package","description":"A quad flat non-leaded package including a first patterned conductive layer, a second patterned conductive layer, a chip, bonding wires and a molding compound is provided. The first patterned conducti","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8497585","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8497585","citation_suggestion":"Patentable. \"Chip package\" (US-8497585). https://patentable.app/patents/US-8497585","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8497585","json":"https://patentable.app/api/llm-context/US-8497585","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:53:53.865Z"}