{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8500306","patent":{"patent_number":"US-8500306","title":"Slim type backlight unit with through-hole adhesive heat dissipating means","assignee":null,"inventors":[],"filing_date":"2011-02-02T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["G02F"],"num_claims":16,"abstract":"A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Slim type backlight unit with through-hole adhesive heat dissipating means","description":"A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at leas","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8500306","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8500306","citation_suggestion":"Patentable. \"Slim type backlight unit with through-hole adhesive heat dissipating means\" (US-8500306). https://patentable.app/patents/US-8500306","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8500306","json":"https://patentable.app/api/llm-context/US-8500306","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:59:08.984Z"}