{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8500984","patent":{"patent_number":"US-8500984","title":"Method for manufacturing printed-circuit board","assignee":null,"inventors":[],"filing_date":"2009-06-24T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":11,"abstract":"A method for manufacturing a printed circuit board having an insulative board and a plurality of electroconductive pads arranged in a grid shape on the insulative board, the method including a step for forming an electroconductive film on the insulative board; a step for forming a pattern on the electroconductive film so as to form the electroconductive pads, a lead wire connected to at least one of the electroconductive pads, and inter-pad wiring for electrically connecting each of the electroconductive pads not connected to the lead wire to any of the electroconductive pads connected to the lead wire, the inter-pad wiring being disposed between mutually adjacent electroconductive pads; a step for plating each of the electroconductive pads by immersing the insulative board in a plating bath and energizing each of the electroconductive pads through the lead wire; and a step for removing the inter-pad wiring."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing printed-circuit board","description":"A method for manufacturing a printed circuit board having an insulative board and a plurality of electroconductive pads arranged in a grid shape on the insulative board, the method including a step fo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8500984","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8500984","citation_suggestion":"Patentable. \"Method for manufacturing printed-circuit board\" (US-8500984). https://patentable.app/patents/US-8500984","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8500984","json":"https://patentable.app/api/llm-context/US-8500984","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:06:20.381Z"}