{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8501539","patent":{"patent_number":"US-8501539","title":"Semiconductor device package","assignee":null,"inventors":[],"filing_date":"2009-11-12T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method for forming a semiconductor device package includes providing a lead frame array having a plurality of leads. Each of the plurality of leads includes an opening extending through the lead from a first surface of the lead to a second surface of the lead, opposite the first surface, and each of the openings is at least partially filled with a solder wettable material. A plurality of semiconductor devices are attached to the lead frame array. The plurality of semiconductor devices are encapsulated, and, after encapsulating, the plurality of semiconductor devices are separated along separation lines which intersect the openings."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package","description":"A method for forming a semiconductor device package includes providing a lead frame array having a plurality of leads. Each of the plurality of leads includes an opening extending through the lead fro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8501539","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8501539","citation_suggestion":"Patentable. \"Semiconductor device package\" (US-8501539). https://patentable.app/patents/US-8501539","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8501539","json":"https://patentable.app/api/llm-context/US-8501539","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:02:09.657Z"}