{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8501622","patent":{"patent_number":"US-8501622","title":"Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-03-29T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least second bond pads comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least second bond pads, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof","description":"A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8501622","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8501622","citation_suggestion":"Patentable. \"Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof\" (US-8501622). https://patentable.app/patents/US-8501622","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8501622","json":"https://patentable.app/api/llm-context/US-8501622","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:06:59.709Z"}