{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502086","patent":{"patent_number":"US-8502086","title":"Laminated wiring board and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2008-05-14T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias 2d to 4d connected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portion 2g is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Laminated wiring board and method for manufacturing the same","description":"Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502086","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502086","citation_suggestion":"Patentable. \"Laminated wiring board and method for manufacturing the same\" (US-8502086). https://patentable.app/patents/US-8502086","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502086","json":"https://patentable.app/api/llm-context/US-8502086","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:06:10.666Z"}