{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502324","patent":{"patent_number":"US-8502324","title":"Semiconductor wafer having scribe lane alignment marks for reducing crack propagation","assignee":null,"inventors":[],"filing_date":"2009-10-19T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A wafer including at least a first die and at least a second die, wherein the first die and the second die are separated from each other by an area located between the first die and the second die, is provided. The wafer further includes an alignment mark group used for aligning the wafer to a tool used for patterning the wafer. The alignment mark group is located entirely within the area between the first die and the second die and the alignment mark group includes a plurality of alignment lines, and wherein each line of the plurality of alignment lines is formed using a plurality of segments separated from each other by a plurality of gaps filled with an insulating material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer having scribe lane alignment marks for reducing crack propagation","description":"A wafer including at least a first die and at least a second die, wherein the first die and the second die are separated from each other by an area located between the first die and the second die, is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502324","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502324","citation_suggestion":"Patentable. \"Semiconductor wafer having scribe lane alignment marks for reducing crack propagation\" (US-8502324). https://patentable.app/patents/US-8502324","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502324","json":"https://patentable.app/api/llm-context/US-8502324","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:47:17.468Z"}