{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502357","patent":{"patent_number":"US-8502357","title":"Integrated circuit packaging system with shaped lead and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-08-13T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A method of manufacture of an integrated circuit packaging system includes: forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface; forming a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface; attaching an integrated circuit die to the die attach paddle; connecting a conductive connector to the integrated circuit die and the package lead; and applying an encapsulation over the integrated circuit die, the encapsulation conformed to the retention structure and exposing a portion of the package lead."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with shaped lead and method of manufacture thereof","description":"A method of manufacture of an integrated circuit packaging system includes: forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a r","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502357","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502357","citation_suggestion":"Patentable. \"Integrated circuit packaging system with shaped lead and method of manufacture thereof\" (US-8502357). https://patentable.app/patents/US-8502357","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502357","json":"https://patentable.app/api/llm-context/US-8502357","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:47:43.561Z"}