{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502366","patent":{"patent_number":"US-8502366","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2011-12-28T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor package includes a body having a first surface and a second surface facing away from the first surface, and formed with a groove in the first surface. First connection parts may electrically connect a portion of the first surface to a portion of the second surface of the body. Second connection parts may electrically connect a portion of a bottom portion of the groove to a portion of the second surface of the body. A lower device may be disposed in the groove of the body, and have third connection parts that are electrically connected with the second connection parts. An upper device may be disposed on the body and the lower device, and have fourth connection parts that are electrically connected with the first connection parts and the third connection parts."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package includes a body having a first surface and a second surface facing away from the first surface, and formed with a groove in the first surface. First connection parts may electr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502366","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502366","citation_suggestion":"Patentable. \"Semiconductor package\" (US-8502366). https://patentable.app/patents/US-8502366","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502366","json":"https://patentable.app/api/llm-context/US-8502366","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:25:08.623Z"}