{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502370","patent":{"patent_number":"US-8502370","title":"Stack package structure and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2012-08-13T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A stack package structure is provided, including: a substrate; an insulating layer formed on the substrate and having openings for exposing die attach pads and conductive pads of the substrate, respectively; a plurality of first and second conductive terminals formed on the insulating layer and electrically connected to the die attach pads and the conductive pads, respectively; a dielectric layer formed on the insulating layer and having a cavity for exposing the first conductive terminals and a plurality of openings exposing the second conductive terminals; copper pillars formed respectively in the openings of the dielectric layer; a semiconductor chip disposed in the cavity and electrically connected to the first conductive terminals; solder balls formed respectively on the copper pillars that are located proximate to the die attach area; and a package structure disposed on and electrically connected to the solder balls."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stack package structure and fabrication method thereof","description":"A stack package structure is provided, including: a substrate; an insulating layer formed on the substrate and having openings for exposing die attach pads and conductive pads of the substrate, respec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502370","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502370","citation_suggestion":"Patentable. \"Stack package structure and fabrication method thereof\" (US-8502370). https://patentable.app/patents/US-8502370","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502370","json":"https://patentable.app/api/llm-context/US-8502370","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:32:41.463Z"}