{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502375","patent":{"patent_number":"US-8502375","title":"Corrugated die edge for stacked die semiconductor package","assignee":null,"inventors":[],"filing_date":"2010-06-29T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":34,"abstract":"A semiconductor die and semiconductor package formed therefrom, and methods of fabricating the semiconductor die and package, are disclosed. The semiconductor die includes an edge formed with a plurality of corrugations defined by protrusions between recesses. Bond pads may be formed on the protrusions. The semiconductor die formed in this manner may be stacked in the semiconductor package in staggered pairs so that the die bond pads on the protrusions of a lower die are positioned in the recesses of the upper die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Corrugated die edge for stacked die semiconductor package","description":"A semiconductor die and semiconductor package formed therefrom, and methods of fabricating the semiconductor die and package, are disclosed. The semiconductor die includes an edge formed with a plural","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502375","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502375","citation_suggestion":"Patentable. \"Corrugated die edge for stacked die semiconductor package\" (US-8502375). https://patentable.app/patents/US-8502375","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502375","json":"https://patentable.app/api/llm-context/US-8502375","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:39:11.166Z"}