{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502379","patent":{"patent_number":"US-8502379","title":"Method for manufacturing semiconductor device, and semiconductor device","assignee":null,"inventors":[],"filing_date":"2011-12-20T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A semiconductor device includes an insulating film base member and a wiring pattern that is formed on the insulating film base member. The wiring pattern has a surface, with at least a peripheral section of the surface being a peeled surface of the wiring pattern peeled from the insulating film base member. The semiconductor device further includes a plating layer that covers the surface of the wiring pattern, and an IC chip that has an active surface with a bump bonded to the wiring pattern. The peeled surface of the wiring pattern is peeled from the insulating film base member around a bonding position of the wiring pattern bonded with the bump."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing semiconductor device, and semiconductor device","description":"A semiconductor device includes an insulating film base member and a wiring pattern that is formed on the insulating film base member. The wiring pattern has a surface, with at least a peripheral sect","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502379","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502379","citation_suggestion":"Patentable. \"Method for manufacturing semiconductor device, and semiconductor device\" (US-8502379). https://patentable.app/patents/US-8502379","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502379","json":"https://patentable.app/api/llm-context/US-8502379","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:48:04.361Z"}