{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502387","patent":{"patent_number":"US-8502387","title":"Integrated circuit packaging system with vertical interconnection and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-12-09T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacture of an integrated circuit packaging system includes: forming an outer contact pad having an outer pad top side; mounting an integrated circuit above the outer pad top side; forming an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation over the integrated circuit with the encapsulation bottom side coplanar with the outer pad top side; and forming a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with vertical interconnection and method of manufacture thereof","description":"A method of manufacture of an integrated circuit packaging system includes: forming an outer contact pad having an outer pad top side; mounting an integrated circuit above the outer pad top side; form","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502387","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502387","citation_suggestion":"Patentable. \"Integrated circuit packaging system with vertical interconnection and method of manufacture thereof\" (US-8502387). https://patentable.app/patents/US-8502387","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502387","json":"https://patentable.app/api/llm-context/US-8502387","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:45:52.789Z"}