{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8502677","patent":{"patent_number":"US-8502677","title":"Method of integrating an identification circuit into a data medium","assignee":null,"inventors":[],"filing_date":"2007-06-13T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["G06K","G06K","G11B"],"num_claims":9,"abstract":"The present invention relates to a method for integrating an identifier circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data. The method consists in etching in the part without data of the conductive layer, at least one resonating slot forming an antenna and coupling an integrated circuit to the slot."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of integrating an identification circuit into a data medium","description":"The present invention relates to a method for integrating an identifier circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer compris","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8502677","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8502677","citation_suggestion":"Patentable. \"Method of integrating an identification circuit into a data medium\" (US-8502677). https://patentable.app/patents/US-8502677","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8502677","json":"https://patentable.app/api/llm-context/US-8502677","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T15:48:08.101Z"}