{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8504958","patent":{"patent_number":"US-8504958","title":"Method and apparatus for thermal analysis","assignee":null,"inventors":[],"filing_date":"2011-10-07T00:00:00.000Z","publication_date":"2013-08-06T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":19,"abstract":"Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC design layout into a set of elements, where at least one element includes several wires. The method computes a set of conductivity groups of values for the set of elements. The method identifies a temperature distribution for the IC design layout based on the set of conductivity groups of values. In some embodiments, each of these elements corresponds to a particular portion of a particular layer of the IC design layout. Each element includes several nodes. Each conductivity group of values is defined by entry values. Each entry value describes how heat flow at a particular node of the element is affected by a temperature change at another particular node of the element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for thermal analysis","description":"Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC desig","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8504958","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8504958","citation_suggestion":"Patentable. \"Method and apparatus for thermal analysis\" (US-8504958). https://patentable.app/patents/US-8504958","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8504958","json":"https://patentable.app/api/llm-context/US-8504958","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:08:09.935Z"}