{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8507309","patent":{"patent_number":"US-8507309","title":"Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same","assignee":null,"inventors":[],"filing_date":"2011-05-25T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":9,"abstract":"A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pad via insulating film under the semiconductor substrate, and a columnar electrode as an external connection electrode connected to the wiring line. As a result, as compared with the case where the photoelectric conversion device region and the connection pad connected to the photoelectric conversion device region are formed on the upper surface of the semiconductor substrate, a piercing electrode for connecting the connection pad and the wiring line does not have to be formed in the semiconductor substrate. Thus, the number of steps can be smaller, and a fabrication process can be less restricted."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same","description":"A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8507309","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8507309","citation_suggestion":"Patentable. \"Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same\" (US-8507309). https://patentable.app/patents/US-8507309","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8507309","json":"https://patentable.app/api/llm-context/US-8507309","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:48:50.793Z"}