{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8507316","patent":{"patent_number":"US-8507316","title":"Protecting T-contacts of chip scale packages from moisture","assignee":null,"inventors":[],"filing_date":"2010-12-22T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes performing a first die-saw on a package structure includes forming a first and a second metal lead extending into a trench of a package structure, wherein the first and the second metal leads contact the side edges of contact pads that are in devices in the package structure. The first and the second metal leads are interconnected through a connecting metal portion. A pre-cut is performed to cut the connecting metal portion to separate the first and the second metal leads, wherein remaining portions of the connecting metal portion have edges after the pre-cut. A dielectric coating is formed over the first and the second metal leads. A die-saw is performed to saw apart the package structure, so that the first and the second dies are separated into separate piece. In each of the resulting pieces, the edges of the remaining portions of the connecting metal portion are covered by remaining portions of the first dielectric coating."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Protecting T-contacts of chip scale packages from moisture","description":"A method includes performing a first die-saw on a package structure includes forming a first and a second metal lead extending into a trench of a package structure, wherein the first and the second me","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8507316","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8507316","citation_suggestion":"Patentable. \"Protecting T-contacts of chip scale packages from moisture\" (US-8507316). https://patentable.app/patents/US-8507316","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8507316","json":"https://patentable.app/api/llm-context/US-8507316","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:07:02.107Z"}