{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8507362","patent":{"patent_number":"US-8507362","title":"Process of forming ultra thin wafers having an edge support ring","assignee":null,"inventors":[],"filing_date":"2011-05-24T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":2,"abstract":"A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Process of forming ultra thin wafers having an edge support ring","description":"A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8507362","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8507362","citation_suggestion":"Patentable. \"Process of forming ultra thin wafers having an edge support ring\" (US-8507362). https://patentable.app/patents/US-8507362","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8507362","json":"https://patentable.app/api/llm-context/US-8507362","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:06:49.531Z"}