{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508022","patent":{"patent_number":"US-8508022","title":"Ultra thin package for electric acoustic sensor chip of micro electro mechanical system","assignee":null,"inventors":[],"filing_date":"2008-07-14T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H04R","H01L"],"num_claims":18,"abstract":"An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Ultra thin package for electric acoustic sensor chip of micro electro mechanical system","description":"An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508022","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508022","citation_suggestion":"Patentable. \"Ultra thin package for electric acoustic sensor chip of micro electro mechanical system\" (US-8508022). https://patentable.app/patents/US-8508022","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508022","json":"https://patentable.app/api/llm-context/US-8508022","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:14:52.072Z"}