{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508023","patent":{"patent_number":"US-8508023","title":"System and method for lowering contact resistance of the radio frequency (RF) shield to ground","assignee":null,"inventors":[],"filing_date":"2010-06-17T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device has a substrate having a plurality of metal traces. A die is electrically attached to a first surface of the substrate. A first plurality of segmented metal traces is formed around a perimeter of the first surface of the substrate, wherein an end section of the first plurality of segmented metal traces is exposed. A mold compound is used for encapsulating the semiconductor device. A first metal plating is formed on a top terminal end section of the first plurality of segmented metal traces. The first metal plating is spread to at least one of the mold compound or the exposed end sections of the first plurality of segmented metal traces. A conductive coating is applied to the mold compound, the exposed end sections of the first plurality of segmented metal traces and to the first metal plating."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System and method for lowering contact resistance of the radio frequency (RF) shield to ground","description":"A semiconductor device has a substrate having a plurality of metal traces. A die is electrically attached to a first surface of the substrate. A first plurality of segmented metal traces is formed aro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508023","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508023","citation_suggestion":"Patentable. \"System and method for lowering contact resistance of the radio frequency (RF) shield to ground\" (US-8508023). https://patentable.app/patents/US-8508023","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508023","json":"https://patentable.app/api/llm-context/US-8508023","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:34:34.554Z"}