{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508026","patent":{"patent_number":"US-8508026","title":"Integrated circuit packaging system with connection supports and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-11-30T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad; forming a support structure between the inner pad and the outer pad; mounting an integrated circuit device over the component pad; attaching an interconnect to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure; and applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with connection supports and method of manufacture thereof","description":"A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508026","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508026","citation_suggestion":"Patentable. \"Integrated circuit packaging system with connection supports and method of manufacture thereof\" (US-8508026). https://patentable.app/patents/US-8508026","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508026","json":"https://patentable.app/api/llm-context/US-8508026","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:09:22.838Z"}