{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508028","patent":{"patent_number":"US-8508028","title":"Chip package and method for forming the same","assignee":null,"inventors":[],"filing_date":"2011-07-15T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"According to an embodiment, a chip package is provided, which includes: a substrate having a first surface and a second surface; a device region formed in the substrate; a passivation layer formed overlying the first surface of the substrate; at least a polymer planarization layer formed overlying the passivation layer; a package substrate disposed overlying the first surface of the substrate; and a spacer layer disposed between the package substrate and the passivation layer, wherein the spacer layer and the package substrate surround a cavity overlying the substrate, wherein the polymer planar layer does not extends to an outer edge of the spacer layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package and method for forming the same","description":"According to an embodiment, a chip package is provided, which includes: a substrate having a first surface and a second surface; a device region formed in the substrate; a passivation layer formed ove","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508028","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508028","citation_suggestion":"Patentable. \"Chip package and method for forming the same\" (US-8508028). https://patentable.app/patents/US-8508028","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508028","json":"https://patentable.app/api/llm-context/US-8508028","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:29:04.773Z"}