{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508032","patent":{"patent_number":"US-8508032","title":"Chip packaging","assignee":null,"inventors":[],"filing_date":"2008-10-20T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":28,"abstract":"An electronic device package comprising: a block of insulating material; an electronic device housed within the insulating material and having a set of contact pads thereon; and a set of electrically conductive contact members at least partially housed within the insulating material, each contact member extending between a respective external contact point at which it is exposed at the surface of the block and an internal contact point from which it is electrically coupled to a respective contact pad on the electronic device, each internal contact point being outside the footprint of the electronic device, the set of contact members including: at least one contact member of a first type whose external contact point is located at least partially within the footprint of the electronic device; and at least one contact member of a second type that is wholly outside the footprint of the device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip packaging","description":"An electronic device package comprising: a block of insulating material; an electronic device housed within the insulating material and having a set of contact pads thereon; and a set of electrically ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508032","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508032","citation_suggestion":"Patentable. \"Chip packaging\" (US-8508032). https://patentable.app/patents/US-8508032","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508032","json":"https://patentable.app/api/llm-context/US-8508032","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:58:13.850Z"}