{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508044","patent":{"patent_number":"US-8508044","title":"Semiconductor package, semiconductor device, and semiconductor module","assignee":null,"inventors":[],"filing_date":"2011-05-06T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package, a semiconductor device, and a semiconductor module, the semiconductor package including a substrate, the substrate having a plurality of inner pads; a semiconductor chip attached to the substrate, the semiconductor chip being electrically connected to the inner pads; a plurality of lands on the substrate, the plurality of lands being electrically connected to the inner pads; and at least one bypass interconnection on the substrate, wherein the plurality of lands includes a first land and a second land, the bypass interconnection is connected to the first land and the second land, and the first land is spaced apart from the second land by a distance of about three times or greater an average distance between adjacent lands of the plurality of lands."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package, semiconductor device, and semiconductor module","description":"A semiconductor package, a semiconductor device, and a semiconductor module, the semiconductor package including a substrate, the substrate having a plurality of inner pads; a semiconductor chip attac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508044","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508044","citation_suggestion":"Patentable. \"Semiconductor package, semiconductor device, and semiconductor module\" (US-8508044). https://patentable.app/patents/US-8508044","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508044","json":"https://patentable.app/api/llm-context/US-8508044","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:08:18.347Z"}