{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508045","patent":{"patent_number":"US-8508045","title":"Package 3D interconnection and method of making same","assignee":null,"inventors":[],"filing_date":"2011-06-30T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"An integrated circuit (IC) package has a package member having a first surface and a second surface opposite the first surface. A first plurality of contact members is physically and electrically fixed to the second surface. An interposer substrate having a second plurality of contact members on one surface thereof which make physical and electrical contact with respective ones of the first plurality of contact members. The interposer substrate is configured to have at least one circuit member mounted to a second surface thereof opposite the one surface thereof."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package 3D interconnection and method of making same","description":"An integrated circuit (IC) package has a package member having a first surface and a second surface opposite the first surface. A first plurality of contact members is physically and electrically fixe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508045","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508045","citation_suggestion":"Patentable. \"Package 3D interconnection and method of making same\" (US-8508045). https://patentable.app/patents/US-8508045","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508045","json":"https://patentable.app/api/llm-context/US-8508045","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:46:14.247Z"}