{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508048","patent":{"patent_number":"US-8508048","title":"Semiconductor device utilizing a package on package structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2011-11-17T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A semiconductor device which includes a substrate, a semiconductor chip which is mounted on the substrate, a package in which an upper surface of the substrate and the semiconductor chip are sealed using an insulating material, and a molding material which is exposed to the upper surface of the package. In addition, the device includes a lead of which one end is connected to the mold material and the other end is electrically connected to the substrate, which is integrally formed of the same material as from a connection portion with the mold material to a connection portion with the substrate, and of which the connection portion with the mold material is exposed to the upper surface of the package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device utilizing a package on package structure and manufacturing method thereof","description":"A semiconductor device which includes a substrate, a semiconductor chip which is mounted on the substrate, a package in which an upper surface of the substrate and the semiconductor chip are sealed us","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508048","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508048","citation_suggestion":"Patentable. \"Semiconductor device utilizing a package on package structure and manufacturing method thereof\" (US-8508048). https://patentable.app/patents/US-8508048","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508048","json":"https://patentable.app/api/llm-context/US-8508048","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:07:02.587Z"}