{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508050","patent":{"patent_number":"US-8508050","title":"Wiring substrate, semiconductor device, and method for manufacturing wiring substrate","assignee":null,"inventors":[],"filing_date":"2011-06-22T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A wiring substrate includes a wiring pattern in an uppermost layer that includes pads. A solder resist layer covers the wiring pattern. A recess exposes part of the wiring pattern from the solder resist layer to form pads. The solder resist layer includes a portion formed in a region corresponding to the recess, a portion formed outward from the recess, and a portion formed inward from the recess. The upper surface of the solder resist layer at the portion corresponding to the recess is higher than the upper surface of the pads but lower than the upper surfaces of the other portions of the solder resist layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, semiconductor device, and method for manufacturing wiring substrate","description":"A wiring substrate includes a wiring pattern in an uppermost layer that includes pads. A solder resist layer covers the wiring pattern. A recess exposes part of the wiring pattern from the solder resi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508050","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508050","citation_suggestion":"Patentable. \"Wiring substrate, semiconductor device, and method for manufacturing wiring substrate\" (US-8508050). https://patentable.app/patents/US-8508050","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508050","json":"https://patentable.app/api/llm-context/US-8508050","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:07:13.260Z"}