{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8508051","patent":{"patent_number":"US-8508051","title":"Protection film having a plurality of openings above an electrode pad","assignee":null,"inventors":[],"filing_date":"2011-09-02T00:00:00.000Z","publication_date":"2013-08-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor device includes a semiconductor substrate 1, an interlayer insulating film 2, 3 formed on the semiconductor substrate 1, an electrode pad 4 formed on the interlayer insulating film 2, 3, a protective film 6 which is formed on the interlayer insulating film 2, 3 to cover a peripheral portion of the electrode pad 4, and has a first opening 5 which exposes a center portion of the electrode pad 4, a divider 7 which is formed on the electrode pad 4 exposed from the first opening 5, and divides the first opening 5 into a plurality of second openings 5d, and a barrier metal 8 formed on the protective film 6 to fill the second openings 5d. The divider 7 is interposed between the electrode pad 4 and the barrier metal 8. "},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Protection film having a plurality of openings above an electrode pad","description":"A semiconductor device includes a semiconductor substrate 1, an interlayer insulating film 2, 3 formed on the semiconductor substrate 1, an electrode pad 4 formed on the interlayer insulating film 2, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8508051","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8508051","citation_suggestion":"Patentable. \"Protection film having a plurality of openings above an electrode pad\" (US-8508051). https://patentable.app/patents/US-8508051","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8508051","json":"https://patentable.app/api/llm-context/US-8508051","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:45:53.557Z"}