{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513060","patent":{"patent_number":"US-8513060","title":"Manufacturing method using multi-step adhesive curing for sealed semiconductor device","assignee":null,"inventors":[],"filing_date":"2012-07-26T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":33,"abstract":"A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of a semiconductor wafer is placed over a front surface of a first support heated to a first temperature. An adhesive sheet is then bonded to a back surface of the semiconductor wafer, after which the semiconductor wafer is subjected to heat treatment at a second temperature higher than the first temperature. After the semiconductor wafer and the adhesive sheet are cut along cutting regions, a plurality of semiconductor chips each having an adhesive patch bonded thereto are obtained. A mother substrate is placed over a front surface of a second support heated to a third temperature and the semiconductor chips are fixed to an upper surface of the mother substrate via the adhesive patch."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method using multi-step adhesive curing for sealed semiconductor device","description":"A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of a s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513060","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513060","citation_suggestion":"Patentable. \"Manufacturing method using multi-step adhesive curing for sealed semiconductor device\" (US-8513060). https://patentable.app/patents/US-8513060","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513060","json":"https://patentable.app/api/llm-context/US-8513060","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:04:22.685Z"}