{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513530","patent":{"patent_number":"US-8513530","title":"Package carrier and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2011-06-15T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":7,"abstract":"A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is provided. A first adhesive layer is formed on the first surface of the substrate. The first adhesive layer and the substrate define a notch. A thermal-conductive element is configured in the notch and fixed into the notch via the first adhesive layer. A second adhesive layer and a metal layer located on the second adhesive layer are formed on the second surface of the substrate. The metal layer is connected to a bottom surface of the thermal-conductive element. The thermal-conductive element is located between the metal layer and the first adhesive layer. The first adhesive layer is removed to expose the first surface of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package carrier and manufacturing method thereof","description":"A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is prov","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513530","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513530","citation_suggestion":"Patentable. \"Package carrier and manufacturing method thereof\" (US-8513530). https://patentable.app/patents/US-8513530","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513530","json":"https://patentable.app/api/llm-context/US-8513530","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:52:37.404Z"}