{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513708","patent":{"patent_number":"US-8513708","title":"Integrated circuit for various packaging modes","assignee":null,"inventors":[],"filing_date":"2008-05-27T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"The present invention provides an integrated circuit suitable for various packaging modes. This integrated circuit includes: a core circuit, a plurality of pads, and a selection circuit. The selection circuit is coupled between the core circuit and the pads for determining the connection state between the core circuit and the pads based on a control signal. When the control signal provides a first value, the core circuit and the pads will be in a first connection state, and the integrated circuit will be applied with a single-die package. However, when the control signal provides a second value, the core circuit and the pads will be in the second connection state, and the integrated circuit will be applied with a multi-die package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit for various packaging modes","description":"The present invention provides an integrated circuit suitable for various packaging modes. This integrated circuit includes: a core circuit, a plurality of pads, and a selection circuit. The selection","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513708","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513708","citation_suggestion":"Patentable. \"Integrated circuit for various packaging modes\" (US-8513708). https://patentable.app/patents/US-8513708","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513708","json":"https://patentable.app/api/llm-context/US-8513708","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:16:49.536Z"}