{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513796","patent":{"patent_number":"US-8513796","title":"Package structure, fabricating method thereof, and package-on-package device thereby","assignee":null,"inventors":[],"filing_date":"2012-03-06T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A package structure, a method of fabricating the package structure, and a package-on-package device are provided, where the package structure includes a metal sheet having perforations and a semiconductor chip including an active surface having electrode pads thereon, where the semiconductor chip is combined with the metal sheet via an inactive surface thereof. Also, a protective buffer layer is formed on the active surface to cover the conductive bumps, and the perforations are arranged around a periphery of the inactive surface of the semiconductor chip. Further, an encapsulant is formed on the metal sheet and in the perforations, for encapsulating the semiconductor chip and exposing the protective buffer layer; and a circuit fan-out layer is formed on the encapsulant and the protective buffer layer and having conductive vias penetrating the protective buffer layer and electrically connecting to the conductive bumps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure, fabricating method thereof, and package-on-package device thereby","description":"A package structure, a method of fabricating the package structure, and a package-on-package device are provided, where the package structure includes a metal sheet having perforations and a semicondu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513796","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513796","citation_suggestion":"Patentable. \"Package structure, fabricating method thereof, and package-on-package device thereby\" (US-8513796). https://patentable.app/patents/US-8513796","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513796","json":"https://patentable.app/api/llm-context/US-8513796","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:42:37.184Z"}