{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513799","patent":{"patent_number":"US-8513799","title":"Method of electrically connecting a microelectronic component","assignee":null,"inventors":[],"filing_date":"2009-04-09T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":29,"abstract":"A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to one another in a direction beyond the first surface of the support structure. Each post may have a top surface remote from the support structure, and the top surfaces can be substantially coplanar with one another. A microelectronic device having a surface with bond pads can overlie the second surface of the support structure with the bond pad-bearing surface of the microelectronic device facing toward the support structure. Connections can electrically connect the posts with the bond pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of electrically connecting a microelectronic component","description":"A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to on","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513799","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513799","citation_suggestion":"Patentable. \"Method of electrically connecting a microelectronic component\" (US-8513799). https://patentable.app/patents/US-8513799","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513799","json":"https://patentable.app/api/llm-context/US-8513799","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:37:02.476Z"}