{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513800","patent":{"patent_number":"US-8513800","title":"Semiconductor device and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2007-07-31T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"After a semiconductor chip is cut out, an In-10 atom % Ag pellet is placed on a metal film. Next, an epoxy sheet on a stiffener is stuck to a ceramic substrate. At this time, the In alloy pellet is sandwiched between a central protrusion portion and the metal film. Then, an In alloy film is formed from the In alloy pellet by heating, melting, and then cooling the In alloy pellet. As a result, the semiconductor chip and a heat spreader are bonded via the metal film and the In alloy film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method for manufacturing the same","description":"After a semiconductor chip is cut out, an In-10 atom % Ag pellet is placed on a metal film. Next, an epoxy sheet on a stiffener is stuck to a ceramic substrate. At this time, the In alloy pellet is sa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513800","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513800","citation_suggestion":"Patentable. \"Semiconductor device and method for manufacturing the same\" (US-8513800). https://patentable.app/patents/US-8513800","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513800","json":"https://patentable.app/api/llm-context/US-8513800","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:12:37.287Z"}