{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513810","patent":{"patent_number":"US-8513810","title":"Semiconductor device and method of manufacturing same","assignee":null,"inventors":[],"filing_date":"2009-07-29T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"There is provided a semiconductor device and a manufacturing method therefor, the semiconductor device requiring flip-chip mounting of a fine pitch electrode, wherein the fine electrode is easily manufactured, resin sealing is not required, and reliability can be improved. In the semiconductor device, one or more LSI chips (1), having an insulating layer (3) surface and an electrode (2) surface on one side, and a substrate (4), having an insulating layer (6) surface and an electrode (5) surface on one side, are bonded by having surfaces of the electrodes and surfaces of the insulating layers face each other via a bonding layer (7) made in a thin film form, in a region excluding the surfaces of the electrodes (2, 5) and the surfaces of the insulating layers (3, 6) in areas surrounding the electrodes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of manufacturing same","description":"There is provided a semiconductor device and a manufacturing method therefor, the semiconductor device requiring flip-chip mounting of a fine pitch electrode, wherein the fine electrode is easily manu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513810","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513810","citation_suggestion":"Patentable. \"Semiconductor device and method of manufacturing same\" (US-8513810). https://patentable.app/patents/US-8513810","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513810","json":"https://patentable.app/api/llm-context/US-8513810","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:31:47.169Z"}