{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513813","patent":{"patent_number":"US-8513813","title":"Stub minimization using duplicate sets of terminals for wirebond assemblies without windows","assignee":null,"inventors":[],"filing_date":"2012-04-05T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":30,"abstract":"A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stub minimization using duplicate sets of terminals for wirebond assemblies without windows","description":"A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513813","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513813","citation_suggestion":"Patentable. \"Stub minimization using duplicate sets of terminals for wirebond assemblies without windows\" (US-8513813). https://patentable.app/patents/US-8513813","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513813","json":"https://patentable.app/api/llm-context/US-8513813","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:31:49.401Z"}