{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8513818","patent":{"patent_number":"US-8513818","title":"Semiconductor device and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2011-03-02T00:00:00.000Z","publication_date":"2013-08-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device includes a semiconductor chip having an element formation surface on which at least one element is formed and including a plurality of electrode pads formed on the element formation surface, an interconnect substrate having a principal surface facing the element formation surface of the semiconductor chip and including a plurality of connection pads formed at positions of the principal surface facing the respective corresponding electrode pads, and a plurality of solder bumps provided between the respective corresponding electrode pads and connection pads, and configured to electrically connect the respective corresponding electrode pads and connection pads together. An UBM layer is formed on a portion of each solder bump closer to the corresponding electrode pad and a barrier metal layer is formed on a portion of each solder bump closer to the corresponding connection pad, and the two layers have substantially the same composition of major materials."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method for fabricating the same","description":"A semiconductor device includes a semiconductor chip having an element formation surface on which at least one element is formed and including a plurality of electrode pads formed on the element forma","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8513818","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8513818","citation_suggestion":"Patentable. \"Semiconductor device and method for fabricating the same\" (US-8513818). https://patentable.app/patents/US-8513818","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8513818","json":"https://patentable.app/api/llm-context/US-8513818","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:48:00.983Z"}