{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8517769","patent":{"patent_number":"US-8517769","title":"Methods of forming copper-based conductive structures on an integrated circuit device","assignee":null,"inventors":[],"filing_date":"2012-03-16T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":41,"abstract":"Disclosed herein are various methods of forming copper-based conductive structures on integrated circuit devices. In one example, the method includes the steps of forming a trench/via in a layer of insulating material, forming a copper-based seed layer above the layer of insulating material and in the trench/via, performing a heating process on the copper-based seed layer to increase an amount of the copper-based seed layer positioned proximate a bottom of the trench/via, performing an etching process on said copper-based seed layer and performing an electroless copper deposition process to fill the trench/via with a copper-based material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of forming copper-based conductive structures on an integrated circuit device","description":"Disclosed herein are various methods of forming copper-based conductive structures on integrated circuit devices. In one example, the method includes the steps of forming a trench/via in a layer of in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8517769","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8517769","citation_suggestion":"Patentable. \"Methods of forming copper-based conductive structures on an integrated circuit device\" (US-8517769). https://patentable.app/patents/US-8517769","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8517769","json":"https://patentable.app/api/llm-context/US-8517769","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:24:04.250Z"}