{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8518722","patent":{"patent_number":"US-8518722","title":"Method for detecting the under-fill void in flip chip BGA","assignee":null,"inventors":[],"filing_date":"2011-03-09T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for detecting the under-fill void in flip chip BGA","description":"A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of inte","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8518722","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8518722","citation_suggestion":"Patentable. \"Method for detecting the under-fill void in flip chip BGA\" (US-8518722). https://patentable.app/patents/US-8518722","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8518722","json":"https://patentable.app/api/llm-context/US-8518722","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:57:08.059Z"}