{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8518743","patent":{"patent_number":"US-8518743","title":"Die structure and die connecting method","assignee":null,"inventors":[],"filing_date":"2011-04-19T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":2,"abstract":"A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die structure and die connecting method","description":"A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is dispo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8518743","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8518743","citation_suggestion":"Patentable. \"Die structure and die connecting method\" (US-8518743). https://patentable.app/patents/US-8518743","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8518743","json":"https://patentable.app/api/llm-context/US-8518743","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:57:58.110Z"}