{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8518751","patent":{"patent_number":"US-8518751","title":"Method for manufacturing semiconductor device including removing a resin burr","assignee":null,"inventors":[],"filing_date":"2011-08-19T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A method of manufacturing a semiconductor device comprises: preparing a lead frame including a package external region and a package internal region, a burred surface being provided at a top end of a side of the lead frame, and a fracture surface being provided in the vicinity of the top end of the side; chamfering the top end of the side in the package external region; mounting a semiconductor element on the lead frame and sealing the semiconductor element with mold resin in the package internal region; and removing resin burr provided on the side of the lead frame in the package external region after the chamfering and the sealing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing semiconductor device including removing a resin burr","description":"A method of manufacturing a semiconductor device comprises: preparing a lead frame including a package external region and a package internal region, a burred surface being provided at a top end of a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8518751","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8518751","citation_suggestion":"Patentable. \"Method for manufacturing semiconductor device including removing a resin burr\" (US-8518751). https://patentable.app/patents/US-8518751","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8518751","json":"https://patentable.app/api/llm-context/US-8518751","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:45:57.124Z"}