{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8518805","patent":{"patent_number":"US-8518805","title":"Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby","assignee":null,"inventors":[],"filing_date":"2008-08-21T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the wafer, and thus prevents defects in a subsequent wire bonding step, such as defects in bonding wire, contamination of a semiconductor device, etc. The method for dicing a semiconductor wafer comprises the steps of: applying a fluorine-containing polymer coating agent onto one surface of a wafer having a circuit pattern formed thereon to form a polymer coating layer, before dicing the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby","description":"Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the wafer, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8518805","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8518805","citation_suggestion":"Patentable. \"Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby\" (US-8518805). https://patentable.app/patents/US-8518805","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8518805","json":"https://patentable.app/api/llm-context/US-8518805","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:59:07.621Z"}