{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8518825","patent":{"patent_number":"US-8518825","title":"Method to manufacture trench-first copper interconnection","assignee":null,"inventors":[],"filing_date":"2012-12-24T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The present invention relates to manufacturing technology of damascene copper interconnection in the semiconductor manufacturing field, and especially relates to a method to manufacture by trench-first copper interconnection. The method to manufacture trench-first copper interconnection forms metal trench and VIA hole structures in the photoresist which can form a hard mask through exposure and development processes, and then forms metal interconnection lines via etching metal trench and VIA hole in one etch process. The above method replaces the existing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method to manufacture trench-first copper interconnection","description":"The present invention relates to manufacturing technology of damascene copper interconnection in the semiconductor manufacturing field, and especially relates to a method to manufacture by trench-firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8518825","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8518825","citation_suggestion":"Patentable. \"Method to manufacture trench-first copper interconnection\" (US-8518825). https://patentable.app/patents/US-8518825","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8518825","json":"https://patentable.app/api/llm-context/US-8518825","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:53:11.189Z"}