{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8519506","patent":{"patent_number":"US-8519506","title":"Thermally conductive substrate for galvanic isolation","assignee":null,"inventors":[],"filing_date":"2011-06-28T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A galvanic isolation integrated circuit system includes a semiconductor substrate; a layer of thermally conductive material, e.g., CVD nano- or poly-diamond thin film or boron nitride CVD thin film, formed over the semiconductor substrate; a first integrated circuit structure formed over the layer of thermally conductive material; a second integrated circuit structure formed over the layer of thermally conductive material, the second integrated circuit structure being spaced apart from the first integrated circuit structure; and a galvanic isolation structure formed over the layer of thermally conductive material between the first and second integrated circuit structures and connected to the first integrated circuit structure and the second integrated circuit structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermally conductive substrate for galvanic isolation","description":"A galvanic isolation integrated circuit system includes a semiconductor substrate; a layer of thermally conductive material, e.g., CVD nano- or poly-diamond thin film or boron nitride CVD thin film, f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8519506","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8519506","citation_suggestion":"Patentable. \"Thermally conductive substrate for galvanic isolation\" (US-8519506). https://patentable.app/patents/US-8519506","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8519506","json":"https://patentable.app/api/llm-context/US-8519506","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T20:32:30.262Z"}