{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8519512","patent":{"patent_number":"US-8519512","title":"Test line placement to improve die sawing quality","assignee":null,"inventors":[],"filing_date":"2006-09-22T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor wafer structure includes a plurality of dies, a first scribe line extending along a first direction, a second scribe line extending along a second direction and intersecting the first scribe line, wherein the first and the second scribe lines have an intersection region. A test line is formed in the scribe line, wherein the test line crosses the intersection region. Test pads are formed in the test line and only outside a free region defined substantially in the intersection region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Test line placement to improve die sawing quality","description":"A semiconductor wafer structure includes a plurality of dies, a first scribe line extending along a first direction, a second scribe line extending along a second direction and intersecting the first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8519512","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8519512","citation_suggestion":"Patentable. \"Test line placement to improve die sawing quality\" (US-8519512). https://patentable.app/patents/US-8519512","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8519512","json":"https://patentable.app/api/llm-context/US-8519512","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:20:48.920Z"}