{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8519513","patent":{"patent_number":"US-8519513","title":"Semiconductor wafer plating bus","assignee":null,"inventors":[],"filing_date":"2012-01-04T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor wafer includes a die, an edge seal, a bond pad, a plating bus, and trace. The die is adjacent to a saw street. The edge seal is along a perimeter of the die and includes a conductive layer formed in a last interconnect layer of the die. The bond pad is formed as part of metal deposition layer above the last interconnect layer or part of the last interconnect layer. The plating bus is within the saw street. The trace is connected to the bond pad and to the plating bus (1) over the edge seal, insulated from the edge seal, and formed in the metal deposition layer or (2) through the edge seal and insulated from the edge seal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer plating bus","description":"A semiconductor wafer includes a die, an edge seal, a bond pad, a plating bus, and trace. The die is adjacent to a saw street. The edge seal is along a perimeter of the die and includes a conductive l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8519513","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8519513","citation_suggestion":"Patentable. \"Semiconductor wafer plating bus\" (US-8519513). https://patentable.app/patents/US-8519513","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8519513","json":"https://patentable.app/api/llm-context/US-8519513","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:36:25.666Z"}