{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8519529","patent":{"patent_number":"US-8519529","title":"Semiconductor package with lid bonded on wiring board and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2011-01-11T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semiconductor chip is covered with the lid on the wiring board. The gap filling resin bonds the wiring board and the lid inside the lid."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with lid bonded on wiring board and method of manufacturing the same","description":"A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semicond","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8519529","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8519529","citation_suggestion":"Patentable. \"Semiconductor package with lid bonded on wiring board and method of manufacturing the same\" (US-8519529). https://patentable.app/patents/US-8519529","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8519529","json":"https://patentable.app/api/llm-context/US-8519529","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:36:28.550Z"}