{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8519543","patent":{"patent_number":"US-8519543","title":"Large sized silicon interposers overcoming the reticle area limitations","assignee":null,"inventors":[],"filing_date":"2012-07-17T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the “active area” in which the through-silicon vias (TSVs) and interconnect conductors are formed in the interposer. At the same time, each of the dies has its external power/ground and I/O signal line connections concentrated into a smaller area of the die. The dies are disposed or mounted on the interposer such that these smaller areas (with the power/ground/IO connections) overlap with the active area of the interposer. In this configuration, a plurality of dies having a combined area substantially greater than the active area of the interposer can be mounted on the interposer (and take advantage of the active area for interconnections)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Large sized silicon interposers overcoming the reticle area limitations","description":"A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the “active area” in which the through-silicon vias (TSVs) and interco","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8519543","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8519543","citation_suggestion":"Patentable. \"Large sized silicon interposers overcoming the reticle area limitations\" (US-8519543). https://patentable.app/patents/US-8519543","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8519543","json":"https://patentable.app/api/llm-context/US-8519543","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:34:33.643Z"}